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Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive

Received: 3 April 2019     Accepted: 23 May 2019     Published: 29 June 2019
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Abstract

A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.

Published in Advances in Materials (Volume 8, Issue 2)
DOI 10.11648/j.am.20190802.16
Page(s) 94-99
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2019. Published by Science Publishing Group

Keywords

Epoxy, Adhesive, One Component, Thermal Cure, DSC, Pot Life, Shelf Life, Curability, Stability, Crystallization Temperature

References
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Cite This Article
  • APA Style

    Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. (2019). Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Advances in Materials, 8(2), 94-99. https://doi.org/10.11648/j.am.20190802.16

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    ACS Style

    Chunfu Chen; Bin Li; Masao Kanari; Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv. Mater. 2019, 8(2), 94-99. doi: 10.11648/j.am.20190802.16

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    AMA Style

    Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv Mater. 2019;8(2):94-99. doi: 10.11648/j.am.20190802.16

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  • @article{10.11648/j.am.20190802.16,
      author = {Chunfu Chen and Bin Li and Masao Kanari and Daoqiang Lu},
      title = {Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive},
      journal = {Advances in Materials},
      volume = {8},
      number = {2},
      pages = {94-99},
      doi = {10.11648/j.am.20190802.16},
      url = {https://doi.org/10.11648/j.am.20190802.16},
      eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20190802.16},
      abstract = {A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.},
     year = {2019}
    }
    

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  • TY  - JOUR
    T1  - Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive
    AU  - Chunfu Chen
    AU  - Bin Li
    AU  - Masao Kanari
    AU  - Daoqiang Lu
    Y1  - 2019/06/29
    PY  - 2019
    N1  - https://doi.org/10.11648/j.am.20190802.16
    DO  - 10.11648/j.am.20190802.16
    T2  - Advances in Materials
    JF  - Advances in Materials
    JO  - Advances in Materials
    SP  - 94
    EP  - 99
    PB  - Science Publishing Group
    SN  - 2327-252X
    UR  - https://doi.org/10.11648/j.am.20190802.16
    AB  - A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.
    VL  - 8
    IS  - 2
    ER  - 

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Author Information
  • Henkel Technology Center-Asia Pacific, Henkel Japan Ltd, Yokohama, Japan

  • Henkel Adhesive Innovation Center, Henkel (China) Co, Ltd, Shanghai, China

  • Henkel Technology Center-Asia Pacific, Henkel Japan Ltd, Yokohama, Japan

  • Henkel Adhesive Innovation Center, Henkel (China) Co, Ltd, Shanghai, China

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