Journal of Photonic Materials and Technology

Special Issue

Laser Processing of Silica Glass: Photosensitivity, Material Modification and Application

Submission deadline: Jun. 07, 2024
Status: Open for Submission
The special issue will feature in-depth research on the advancements and emerging trends in laser processing techniques for fiber and silica glass. It will highlight the latest developments in laser technology and its applications in telecommunication, sensing, and quantum technology. The issue will cover a wide range of topics, including the optimization of laser parameters, such as wavelength, power density, and pulse duration, for efficient processing of silica glass. Moreover, it will explore the fabrication of high-performance integrated devices using laser-induced techniques, investigating the effects of different laser types (continuous and pulsed) and pulse durations (nanoseconds, picoseconds, femtoseconds) on the properties and performance of the fabricated devices. Additionally, the special issue will shed light on the fundamental mechanisms underlying the photosensitivity of silica glass, elucidating the interaction between the laser and the glass material at a microscopic level. Furthermore, it will address the challenges associated with laser-induced damage in silica glass, providing insights into mitigating strategies and exploring novel approaches to enhance the resilience of the glass material.

Potential topics include but are not limited to the following:

  1. 1. Recent Advances in Silica based data storage devices by femtosecond laser writing
  2. 2. laser additive manufacturing silica glass
  3. 3. Characterization of laser inscribed photonics devices in doped fiber and planar silica
  4. 4. Threshold power/energy for silica modification and damage
  5. 5. Fundamental mechanisms involved in silica upon laser exposure (continuous and nano/pico/femto seconds)
  6. 6. Numerical simulation of laser processes.
Lead Guest Editor
Guest Editor
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