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Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation

Received: 3 September 2017     Accepted: 21 September 2017     Published: 2 November 2017
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Abstract

Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.

Published in International Journal of Industrial and Manufacturing Systems Engineering (Volume 2, Issue 5)
DOI 10.11648/j.ijimse.20170205.11
Page(s) 48-56
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2017. Published by Science Publishing Group

Keywords

Fin Geometry, Fin Cooling, Computer Microchips, Heat Transfer, Heatsink

References
[1] Casey, O (2006) “Heat Transfer Analysis of Fins of Varying Geometry and Thermal Conductivity” Mechanical Engineering Department Glassboro, New Jersey.
[2] Kenan, Y., Nihal, A., Isak, K, and Cafer, C. (2006) “Experimental investigation of thermal resistance of a heat sink with hexagonal fins” Applied Thermal Engineering, vol 26, pp 2262-2271.
[3] Tuckerman, D. B. and Pease, R. F. W., High-performance heat sinking for VLSI, IEEE Electron Device Letters, 1981
[4] Intel, 2007. Intel® Celeron® Processor 200Δ Sequence: Thermal and mechanical design guidelines, October, 2007. http://www.intel.com/assets/pdf/designguide/318548.pdf (Accessed December, 2015).
[5] Chassis Plan Ltd. Cooling and noise in industrial and military computer systems http://www.chassis-plans.com/whitepapers/cooling-and-noise/ (Accessed December, 2015).
[6] Intel, 2010. Intel® Atom™ Processor N450, D410 and D510 for Embedded Applications: Thermal design guide February 2010. http://www.intel.co.uk/content/dam/www/public/us/en/documents/design-guides/atom-n450-n410-d510-thermal-guide.pdf (Accessed December, 2015).
[7] Xiaolong, Z., Yi F., Johan, Teng, W, and Zhaonium, C. (2007) “A Study of CFD Simulation for On-Chip Cooling with “D CNT Micro Fin Array” IEEE 1-4244-1253-6.
[8] Khan WA, Culham RJ, Yovanovich MM. Analytical model for convection heat transfer from tube banks. J Thermophys Heat Transfer 2006; 20: 720-7.
[9] Czylwik, A. Matlab for Communications, http://nts.uni-duisburg-essen.de/downloads/matlab/MatlabSeminar_main.pdf (accessed on 05/2016).
[10] Rajput, R. K. (2008). “Heat and Mass Transfer” S. Chand & Company Ltd. Pp 205-245 Ram Nagar, New Delhi.
[11] Incropera, P. F (1996). “Fundamentals of heat and mass transfer” John Wiley & Sons Inc. Pp 110- 127, 377-383. New York.
[12] Mills, F. A (1997). “Heat and Mass Transfer”. IRWIN Publishers Pp 80-101. Chicago.
[13] Robert H. P; Green, W.D. “Chemical Engineer’s Handbook” seventh edition, McGraw-Hill company.
[14] Marlin R. V, (1995) “Liquid Cooling Performance for a 3-D Multichip Module and Miniature Heat Sink.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol 18, pp 68-73.
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    Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. (2017). Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. International Journal of Industrial and Manufacturing Systems Engineering, 2(5), 48-56. https://doi.org/10.11648/j.ijimse.20170205.11

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    ACS Style

    Atuman Samaila Joel; Usman Aliyu El-Nafaty; Yusuf Isah Makarfi; Jibril Mohammed; Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int. J. Ind. Manuf. Syst. Eng. 2017, 2(5), 48-56. doi: 10.11648/j.ijimse.20170205.11

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    AMA Style

    Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int J Ind Manuf Syst Eng. 2017;2(5):48-56. doi: 10.11648/j.ijimse.20170205.11

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  • @article{10.11648/j.ijimse.20170205.11,
      author = {Atuman Samaila Joel and Usman Aliyu El-Nafaty and Yusuf Isah Makarfi and Jibril Mohammed and Nuhu Mamman Musa},
      title = {Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation},
      journal = {International Journal of Industrial and Manufacturing Systems Engineering},
      volume = {2},
      number = {5},
      pages = {48-56},
      doi = {10.11648/j.ijimse.20170205.11},
      url = {https://doi.org/10.11648/j.ijimse.20170205.11},
      eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijimse.20170205.11},
      abstract = {Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.},
     year = {2017}
    }
    

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  • TY  - JOUR
    T1  - Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation
    AU  - Atuman Samaila Joel
    AU  - Usman Aliyu El-Nafaty
    AU  - Yusuf Isah Makarfi
    AU  - Jibril Mohammed
    AU  - Nuhu Mamman Musa
    Y1  - 2017/11/02
    PY  - 2017
    N1  - https://doi.org/10.11648/j.ijimse.20170205.11
    DO  - 10.11648/j.ijimse.20170205.11
    T2  - International Journal of Industrial and Manufacturing Systems Engineering
    JF  - International Journal of Industrial and Manufacturing Systems Engineering
    JO  - International Journal of Industrial and Manufacturing Systems Engineering
    SP  - 48
    EP  - 56
    PB  - Science Publishing Group
    SN  - 2575-3142
    UR  - https://doi.org/10.11648/j.ijimse.20170205.11
    AB  - Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.
    VL  - 2
    IS  - 5
    ER  - 

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Author Information
  • Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria

  • Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria

  • Department Chemical Engineering, Durban University of Technology, Durban, Republic of South Africa

  • Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria

  • Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria

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