International Journal of Biomedical Science and Engineering

| Peer-Reviewed |

Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery

Received: 29 November 2017    Accepted: 15 January 2018    Published: 01 February 2018
Views:       Downloads:

Share This Article

Abstract

Robot supported minimally invasive interventions are state of the art in operating theatres. To increase the accuracy of surgical instrument positioning, high-precision motion tracking systems are required. The miniaturization of microelectromechanical systems (MEMS) facilitates the placing of orientation detection sensors close to the mounting of the surgical instrument to enhance positioning accuracy. A high resolution inclination sensor was developed using the innovative approach of laser-micro-welding. Trench sizes down to 800 nm are fabricated with more than 6-fold increase in aspect ratios (structure depth to electrode gap) compared to sensors without gap reduction. Electrical and physical tests as well as finite-element-simulations were performed. An increased sensitivity from 7.2 fF/° up to 60 fF/° was verified for the sensor with reduced electrode gap and a customized ASIC.

DOI 10.11648/j.ijbse.20180601.11
Published in International Journal of Biomedical Science and Engineering (Volume 6, Issue 1, March 2018)
Page(s) 1-6
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2024. Published by Science Publishing Group

Keywords

Surgical Robot Navigation, Inertial Sensor, Inclination Sensor, Microelectromechanical System (MEMS), Gap Reduction

References
[1] J. Marescaux, J. Leroy, F. Rubino et al. Transcontinental Robot-Assisted Remote Telesurgery: Feasibility and Potential Applications. Annals of Surgery. Vol. 235, No. 4, 2002, pp. 487-492.
[2] The Lancet. Robotic surgery evaluation: 10 years too late. The Lancet. Vol. 388, Iss. 10049, 2016, p. 1026, DOI 10.1016/S0140-6736 (16) 31586-0.
[3] K. J. Rebello. Applications of MEMS in surgery. Proceedings of the IEEE. Vol. 92, Iss. 1, 2004, pp. 43-55, DOI 10.1109/JPROC.2003.820536.
[4] A. Bertz, M. Küchler, R. Knöfler, T. Gessner. A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers. Sensors and Actuators A: Physical. Vol. 97-98, 2002, pp. 691-701, DOI 10.1016/S0924-4247 (02) 00006-7.
[5] R. Abdolvand, F. Ayazi. An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon. Sensors and Actuators A: Physical. Vol. 144, Iss. 1, 2008, pp. 109-116, DOI 10.1016/j.sna.2007.12.026.
[6] F. Marty, L. Rousseau, B. Saadany et al. Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures. Microelectronics Journal. Vol. 36, Iss. 7, 2005, pp. 673-677, DOI 10.1016/j.mejo.2005.04.039.
[7] S. Tachi, K. Tsujimoto, S. Okudaira. Low-temperature reactive ion etching and microwave plasma etching of silicon. Applied Physics Letters. Vol. 52, Iss. 8, p. 616, DOI 10.1063/1.99382.
[8] F. Lärmer, A. Schilp. Method of anisotropically etching silicon. Patent US 5501893, 1996.
[9] B. Wu, A. Kumar, S. Parmarthy. High aspect ratio silicon etch: A review. Journal of Applied Physics. Vol. 108, Iss. 5, 051101, 2010, DOI 10.1063/1.3474652.
[10] S. D. Senturia. CAD challenges for microsensors, mi-croactuators, and microsystems. Proceedings of the IEEE. Vol. 86, Iss. 8, 1998, pp. 1611-1626, DOI 10.1109/5.704266.
[11] D. Galayko et al. Design, realization and testing of micro-mechanical resonators in thick-film silicon technology with postprocess electrode-to-resonator gap reduction. Journal of Micromechanics and Microengineering. Vol. 13, 2004, pp. 134-140.
[12] C. Acar et al. Post-Release Capacitance Enhancement in Micromachined Devices. IEEE Sensors, Vienna, Austria, Oct. 24-27, 2004, pp. 268-271, DOI 10.1109/ICSENS.2004.1426153.
[13] W.-C. Chen et al. Realizing deep-submicron gap spacing for CMOS MEMS resonators with frequency tuning capability via modulated boundary conditions. IEEE International Conference on MEMS, Hong Kong, China, Jan. 24-28, 2010, pp. 735-738, DOI 10.1109/MEMSYS.2010.5442301.
[14] D. Reuter et al. In-Process Gap Reduction of Capacitive Transducers. Sensors and Actuators A: Physical. Vol. 126, Iss. 1, 2006, pp. 211-217, DOI 10.1016/j.sna.2005.09.033.
[15] M. Nowack et al. Novel Post-Process Gap Reduction Technology of High Aspect Ratio Microstructures Utilizing Micro Welding. Transducers Conference, Beijing, China, Jun. 5-9, 2011, pp. 1352-1355, DOI 10.1109/TRANSDUCERS.20­11.59­­­­69505.
[16] Meinecke C et al. Micro welding of aluminum for post process electrode gap reduction using femtosecond laser. Transducers Conference, Anchorage, Alaska, USA, Jun. 21-25, 2015, pp. 1354-1357, DOI  10.1109/TRANSDUCERS.2015.7181183.
[17] J. Schille et al. Highspeed Laser Micro Processing using Ultrashort Laser Pulses. Journal of Laser Micro / Nanoengineering. Vol. 9, No. 2, 2014, pp. 161-168, DOI  10.2961/jlmn.2014.02.0015.
[18] T. Veijola. Compact models for squeezed-film dampers with inertial and rarefied gas effects. Journal of Micromechanics and Microengineering. Vol. 14, 2004, pp. 1109-1118.
Author Information
  • Department of Microsystems and Biomedical Engineering, Faculty of Electrical Engineering and Information Technology, University of Technology Chemnitz, Chemnitz, Germany

  • Department of Microsystems and Biomedical Engineering, Faculty of Electrical Engineering and Information Technology, University of Technology Chemnitz, Chemnitz, Germany

  • Center for Microtechnologies, University of Technology Chemnitz, Chemnitz, Germany

  • Center for Microtechnologies, University of Technology Chemnitz, Chemnitz, Germany

  • Department of Microsystems and Biomedical Engineering, Faculty of Electrical Engineering and Information Technology, University of Technology Chemnitz, Chemnitz, Germany

Cite This Article
  • APA Style

    Benjamin Arnold, Daniel Wohlrab, Christoph Meinecke, Danny Reuter, Jan Mehner. (2018). Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery. International Journal of Biomedical Science and Engineering, 6(1), 1-6. https://doi.org/10.11648/j.ijbse.20180601.11

    Copy | Download

    ACS Style

    Benjamin Arnold; Daniel Wohlrab; Christoph Meinecke; Danny Reuter; Jan Mehner. Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery. Int. J. Biomed. Sci. Eng. 2018, 6(1), 1-6. doi: 10.11648/j.ijbse.20180601.11

    Copy | Download

    AMA Style

    Benjamin Arnold, Daniel Wohlrab, Christoph Meinecke, Danny Reuter, Jan Mehner. Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery. Int J Biomed Sci Eng. 2018;6(1):1-6. doi: 10.11648/j.ijbse.20180601.11

    Copy | Download

  • @article{10.11648/j.ijbse.20180601.11,
      author = {Benjamin Arnold and Daniel Wohlrab and Christoph Meinecke and Danny Reuter and Jan Mehner},
      title = {Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery},
      journal = {International Journal of Biomedical Science and Engineering},
      volume = {6},
      number = {1},
      pages = {1-6},
      doi = {10.11648/j.ijbse.20180601.11},
      url = {https://doi.org/10.11648/j.ijbse.20180601.11},
      eprint = {https://download.sciencepg.com/pdf/10.11648.j.ijbse.20180601.11},
      abstract = {Robot supported minimally invasive interventions are state of the art in operating theatres. To increase the accuracy of surgical instrument positioning, high-precision motion tracking systems are required. The miniaturization of microelectromechanical systems (MEMS) facilitates the placing of orientation detection sensors close to the mounting of the surgical instrument to enhance positioning accuracy. A high resolution inclination sensor was developed using the innovative approach of laser-micro-welding. Trench sizes down to 800 nm are fabricated with more than 6-fold increase in aspect ratios (structure depth to electrode gap) compared to sensors without gap reduction. Electrical and physical tests as well as finite-element-simulations were performed. An increased sensitivity from 7.2 fF/° up to 60 fF/° was verified for the sensor with reduced electrode gap and a customized ASIC.},
     year = {2018}
    }
    

    Copy | Download

  • TY  - JOUR
    T1  - Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery
    AU  - Benjamin Arnold
    AU  - Daniel Wohlrab
    AU  - Christoph Meinecke
    AU  - Danny Reuter
    AU  - Jan Mehner
    Y1  - 2018/02/01
    PY  - 2018
    N1  - https://doi.org/10.11648/j.ijbse.20180601.11
    DO  - 10.11648/j.ijbse.20180601.11
    T2  - International Journal of Biomedical Science and Engineering
    JF  - International Journal of Biomedical Science and Engineering
    JO  - International Journal of Biomedical Science and Engineering
    SP  - 1
    EP  - 6
    PB  - Science Publishing Group
    SN  - 2376-7235
    UR  - https://doi.org/10.11648/j.ijbse.20180601.11
    AB  - Robot supported minimally invasive interventions are state of the art in operating theatres. To increase the accuracy of surgical instrument positioning, high-precision motion tracking systems are required. The miniaturization of microelectromechanical systems (MEMS) facilitates the placing of orientation detection sensors close to the mounting of the surgical instrument to enhance positioning accuracy. A high resolution inclination sensor was developed using the innovative approach of laser-micro-welding. Trench sizes down to 800 nm are fabricated with more than 6-fold increase in aspect ratios (structure depth to electrode gap) compared to sensors without gap reduction. Electrical and physical tests as well as finite-element-simulations were performed. An increased sensitivity from 7.2 fF/° up to 60 fF/° was verified for the sensor with reduced electrode gap and a customized ASIC.
    VL  - 6
    IS  - 1
    ER  - 

    Copy | Download

  • Sections