To assess the rationality and reliability of the finite element model, finite element analysis and test were performed on the braze residual stress between two materials with different expansion coefficients. The samples used in this paper were obtained by welding tungsten - copper wafers and kovar wafers. The finite element analysis method and stress testing method are introduced briefly. In order to describe the welding process, this paper uses several related equations to illustrate the simulation calculation, and introduces the complex analysis process of the test method, and briefly introduces the processing method of the test data. The test results mainly include the residual stress values corresponding to different depths on the drilling path, and the stress state at this position is expressed by tensile stress and compressive stress. The results of finite element simulation analysis are comprehensive. In order to compare with the test results, the direction and size of tensile stress and compressive stress of the section are selected. The results of test are consistent with those of finite element analysis. It was suggested that the residual stress obtained from the finite element model is feasible and can be referenced to understand the residual stress of the actual devices. Then an example is given to verify the consistency of the two methods.
| Published in | Journal of Electrical and Electronic Engineering (Volume 7, Issue 3) |
| DOI | 10.11648/j.jeee.20190703.11 |
| Page(s) | 75-81 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2024. Published by Science Publishing Group |
Finite Element, Stress, Braze
| [1] | Morgan H S. Thermal stresses in layered electrical assemblies bonded with solder [J]. ASME Journal of Electronic Packaging. 1991, 113 (4): 350-354. |
| [2] | Wang xuemei, Sun xuewei. Thermal stress analysis of power device shells [J]. Semiconductor science, 2000, 21 (4): 409-413. |
| [3] | Liu xiaojia, Lin jian, lei yongping, etc. Measurement and finite element analysis of residual stress on electron beam welding surface of titanium alloy [J]. Journal of aeronautical materials, 2016, 36 (4): 35-40. |
| [4] | Si jianwen, Guo huaixin, Wang ziliang. TO-type ceramic shell seal failure mode finite element analysis [J]. Electronics & packing, 2016, 16 (2): 9-13. |
| [5] | KN Tu. Reliability challenges in 3D IC packaging technology [J]. Microelectronics Reliability, 2011 (51): 517-523. |
| [6] | Chen Hui-li, Zhong Yi, Wang Hua-kun, etc. Research progress of the method for residual stress measurement [J]. Yunnan Metallurgy, 2005, 34 (3): 52-54. |
| [7] | Guo huaixin, Hu jin, Cao kun. Finite element analysis of residual stress in Al2O3_WCu package [J]. Research and development of solid state electronics, 2014, 34 (5): 492-497. |
| [8] | Yap Boon Kar, Noor Azrina Talik. Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS [J]. Microelectronics International, 2013, 1 (30): 14-18. |
| [9] | LI Xin-yu, Gao Longqiao, Lu Yan-ping, etc. Finite element stress analysis on nitride aluminum ceramics to Kovar Metal Sealing parts [J], 2009: 75-77. |
| [10] | Abaqus Theory Manual. |
| [11] | Li weilong, Yu li, Wang xuanguo. Test of residual stress by hole drilling strain method [J]. Wuhan Iron and Steel Corporation Technology, 2013, 51 (6): 55-59. |
| [12] | An huping. review of strain method for solving principal stress formula under special plane stress state [J]. Automation&instrumentation, 2014, 34 (7): 181-184. |
| [13] | Song tianmin. Generation and elimination of welding residual stress [M]. Beijing: China chemistry press, 2004. |
| [14] | Liu dongjia. The study of plane stress states with complex numbers [J]. Mechanics and practice, 1997, 19 (5): 70-72. |
| [15] | Sun xunfang, Fang xiaoshu, Lu yaohong. Mechanics of materials (vol. 2). Beijing: higher education press, 1991, 333~343. |
APA Style
Liu Shichao, Pang Xueman, Zhou Hao, Cheng Kai. (2019). Finite Element Analysis and Test of Braze Residual Stress Between Different Materials. Journal of Electrical and Electronic Engineering, 7(3), 75-81. https://doi.org/10.11648/j.jeee.20190703.11
ACS Style
Liu Shichao; Pang Xueman; Zhou Hao; Cheng Kai. Finite Element Analysis and Test of Braze Residual Stress Between Different Materials. J. Electr. Electron. Eng. 2019, 7(3), 75-81. doi: 10.11648/j.jeee.20190703.11
AMA Style
Liu Shichao, Pang Xueman, Zhou Hao, Cheng Kai. Finite Element Analysis and Test of Braze Residual Stress Between Different Materials. J Electr Electron Eng. 2019;7(3):75-81. doi: 10.11648/j.jeee.20190703.11
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Download@article{10.11648/j.jeee.20190703.11,
author = {Liu Shichao and Pang Xueman and Zhou Hao and Cheng Kai},
title = {Finite Element Analysis and Test of Braze Residual Stress Between Different Materials},
journal = {Journal of Electrical and Electronic Engineering},
volume = {7},
number = {3},
pages = {75-81},
doi = {10.11648/j.jeee.20190703.11},
url = {https://doi.org/10.11648/j.jeee.20190703.11},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.jeee.20190703.11},
abstract = {To assess the rationality and reliability of the finite element model, finite element analysis and test were performed on the braze residual stress between two materials with different expansion coefficients. The samples used in this paper were obtained by welding tungsten - copper wafers and kovar wafers. The finite element analysis method and stress testing method are introduced briefly. In order to describe the welding process, this paper uses several related equations to illustrate the simulation calculation, and introduces the complex analysis process of the test method, and briefly introduces the processing method of the test data. The test results mainly include the residual stress values corresponding to different depths on the drilling path, and the stress state at this position is expressed by tensile stress and compressive stress. The results of finite element simulation analysis are comprehensive. In order to compare with the test results, the direction and size of tensile stress and compressive stress of the section are selected. The results of test are consistent with those of finite element analysis. It was suggested that the residual stress obtained from the finite element model is feasible and can be referenced to understand the residual stress of the actual devices. Then an example is given to verify the consistency of the two methods.},
year = {2019}
}
TY - JOUR T1 - Finite Element Analysis and Test of Braze Residual Stress Between Different Materials AU - Liu Shichao AU - Pang Xueman AU - Zhou Hao AU - Cheng Kai Y1 - 2019/07/12 PY - 2019 N1 - https://doi.org/10.11648/j.jeee.20190703.11 DO - 10.11648/j.jeee.20190703.11 T2 - Journal of Electrical and Electronic Engineering JF - Journal of Electrical and Electronic Engineering JO - Journal of Electrical and Electronic Engineering SP - 75 EP - 81 PB - Science Publishing Group SN - 2329-1605 UR - https://doi.org/10.11648/j.jeee.20190703.11 AB - To assess the rationality and reliability of the finite element model, finite element analysis and test were performed on the braze residual stress between two materials with different expansion coefficients. The samples used in this paper were obtained by welding tungsten - copper wafers and kovar wafers. The finite element analysis method and stress testing method are introduced briefly. In order to describe the welding process, this paper uses several related equations to illustrate the simulation calculation, and introduces the complex analysis process of the test method, and briefly introduces the processing method of the test data. The test results mainly include the residual stress values corresponding to different depths on the drilling path, and the stress state at this position is expressed by tensile stress and compressive stress. The results of finite element simulation analysis are comprehensive. In order to compare with the test results, the direction and size of tensile stress and compressive stress of the section are selected. The results of test are consistent with those of finite element analysis. It was suggested that the residual stress obtained from the finite element model is feasible and can be referenced to understand the residual stress of the actual devices. Then an example is given to verify the consistency of the two methods. VL - 7 IS - 3 ER -
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